Enhancement of the efficiency of heat removal from powerful electronic devices through thermal interfaces based on aluminum nitride films
DOI:
https://doi.org/10.15407/dopovidi2018.03.059Keywords:
aluminum nitride, heat sink, LED, thermal interfacesAbstract
The efficiency of aluminum nitride films as thermal interfaces has been studied. It is shown that such films obtained in a hybrid helicon-arc ion-plasma reactor significantly improve the heat removal from the crystals of electronic devices, in particular, from powerful LEDs or LED assemblies, and thus noteworthy increase their luminosity, reliability, and durability.
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